6 Layers FR4 HDI PCB Circuit in 2oz copper with Immersion Tin Surface Finished

Product Detail

Basic Info

Model No.	PCB-A12
Transport package	Vacuum Packing
Certification	UL,ISO9001&ISO14001,RoHS
Application	Consumer electronics
Minimum Space/Line	0.075mm/3mil
Production Capacity	50,000 s.q.m/month
HS Code	853400900
Origin	Made in China

Product Description

HDI PCB Introduction

HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCBs are made through microvias, buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

Applications

HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.

Technical & Capability

Item	Production Capacity
Layer Counts	1-20 layers
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc
Board thickness	0.10mm-8.00mm
Maximum Size	600mmX1200mm
Board Outline Tolerance	+0.10mm
Thickness Tolerance(t≥0.8mm)	±8%
Thickness Tolerance(t<0.8mm)	±10%
Insulation Layer Thickness	0.075mm--5.00mm
Minimum Line	0.075mm
Minimum Space	0.075mm
Out Layer Copper Thickness	18um--350um
Inner Layer Copper Thickness	17um--175um
Drilling Hole(Mechanical)	0.15mm--6.35mm
Finish Hole(Mechanical)	0.10mm-6.30mm
Diameter Tolerance(Mechanical)	0.05mm
Registration(Mechanical)	0.075mm
Aspect Ratio	16:1
Solder Mask Type	LPI
SMT Mini.Solder Mask Width	0.075mm
Mini. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm
Impedance control Tolerance	±10%
Surface finish/treatment	HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold Finger

PCB Production Process

The process starts with designing Layout of the PCB using any PCB designing software / CAD Tool (Proteus, Eagle, Or CAD).

All rest of the steps are of Manufacturing Process of a Rigid Printed Circuit Board is same as Single Sided PCB or Double Sided PCB or Multi-layer PCB.

Q/T Lead Time

Category	Quickest Lead Time	Normal Lead Time
Double-sided	24hrs	120hrs
4 Layers	48hrs	172hrs
6 Layers	72hrs	192hrs
8 Layers	96hrs	212hrs
10 Layers	120hrs	268hrs
12 Layers	120hrs	280hrs
14 Layers	144hrs	292hrs
16-20 Layers	Depends on the specific requirements
Above 20 Layers	Depends on the specific requirements

ABIS' move to control FR4 PCBS

Hole Preparation

Removing debris carefully & adjusting drill machine parameters: before plating through with copper, ABIS pays high attention to all holes on an FR4 PCB treated to remove debris, surface irregularities, and epoxy smear, the clean holes ensure the plating successfully adheres to the hole walls. also, early in the process, drill machine parameters are adjusted accurately.

Surface Preparation

Deburring carefully: our experienced tech workers will be aware ahead of time that the only way to avoid a bad outcome is to anticipate the need for special handling and to take the appropriate steps to be sure that the process is done carefully and correctly.

Thermal Expansion Rates

Accustomed to dealing with the various materials, ABIS will be able to analyze the combination to be sure that it is appropriate. then keeping the long-term reliability of the CTE (coefficient of thermal expansion), with the lower CTE, the less likely the plated through holes are to fail from repeated flexing of the copper which forms the internal layer interconnections.

Scaling

ABIS control the circuitry is scaled-up by known percentages in anticipation of this loss so that the layers will return to their as-designed dimensions after the lamination cycle is complete. also, using the laminate manufacturer’s baseline scaling recommendations in combination with in-house statistical process control data, to dial-in scale factors that will be consistent over time within that particular manufacturing environment.

Machining

When the time comes to build your PCB, ABIS be sure that you choose has the right equipment and experience to produce it

ABIS Quality Mission

The pass rate of incoming material above 99.9%, the number of mass rejection rates below 0.01%.

ABIS certified facilities control all key processes to eliminate all potential issues before producing.

ABIS utilizes advanced software to perform extensive DFM analysis on incoming data, and uses advanced quality control systems throughout the manufacturing process.

ABIS performs 100% visual and AOI inspection as well as performing electrical testing, high voltage testing, impedance control testing, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.

Certificate

FAQ

1.Where does the resin material come from in ABIS?

Most of them from Shengyi Technology Co., Ltd. (SYTECH), who has been the world's second largest CCL manufacturer in terms of sales volume, from 2013 to 2017. We established long-term relations of cooperation since 2006. The FR4 resin material (Model S1000-2, S1141, S1165, S1600) are mainly used for making single and double-sided printed circuit boards as well as multi-layer boards. Here comes details for your reference.

For FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA

For CEM-1 & CEM 3: Sheng Yi, King Board

For High Frequency : Sheng Yi

For UV Cure: Tamura, Chang Xing ( * Available colour : Green) Solder for Single Side

For Liquid Photo: Tao Yang, Resist (Wet Film)

Chuan Yu ( * Available colors : White, Imaginable Solder Yellow, Purple, Red, Blue, Green, Black)

2.Pre-Sale and After-Sale Service？

),1 Hour quotation

b),2 hours of complaint feedback

c),7*24 hour technical support

d),7*24 order service

e),7*24 hour delivery

f),7*24 production run

3.Can you manufacture my PCBs from a picture file?

No, we can't accept picture files, if you no not have Gerber file, can you send us sample to copy it.

PCB&PCBA Copy Process:

4.How do you test and control the quality?

Our Quality Assuring Procedures as below:

a),Visual Inspection

b),Flying probe, fixture tool

c), Impedance control

d), Solder-ability detection

e), Digital metallo graghic microscope

f),AOI (Automated Optical Inspection)

5.When will my PCB files be checked?

Checked within 12 hours. Once Engineer's question and working file checked, we'll start the production.

6.What are the advantages of manufacturing in ABIS?

Look around you. So many products come from China. Obviously, this has several reasons. It is no longer just about price.

Preparing quotations is done quickly.

Production orders are completed quickly. You could plan orders scheduled for months in advance, we can arrange them immediately once PO confirmed.

Supply chain expanded enormously. That is why we can purchase every component from a specialized partner very quickly.

Flexible and passionate employees. As a result, we accept every order.

24 online service for urgent needs. Working hours of +10 hours per day.

Lower costs. No hidden cost. Save on personnel, overhead and logistics.

7.Do you have MOQ of products? If yes, what is the minimum quantity?

ABIS has no MOQ requirements for either PCB or PCBA.

8.What kinds of testing do you have?

ABlS performs 100% visual and AOl inspection as well as performing electrical testing, high voltage testing, impedance control testing, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.

9.Do you have MOQ of products? If yes, what is the minimum quantity?